Specification
| Item | Parameter |
|---|---|
| Capacity | 150 - 1200 kg/h (model dependent) |
| Number of baking plates | 27 - 75 plates |
| Plate size | From 280 x 180 mm up to 460 x 280 mm |
| Wafer thickness | 1.5 - 3 mm |
| Heating method | Gas, electric or thermal oil |
| Cream layers | 3 - 15 layers, adjustable |
| Cutting method | Wire or blade cutter for bars and sticks |
| Voltage | 380V/50Hz or customized |
| Control system | PLC with touch screen HMI |
| Material contact parts | SUS304 stainless steel |
Application
Suitable for factories producing cream wafer biscuits, chocolate wafer bars, hazelnut wafers, wafer sticks and wafer cookies. It is used by established biscuit manufacturers adding a wafer range, by snack brands building a branded multipack and by contract plants that supply private label wafer products to retailers.
Common fillings include vanilla, chocolate, strawberry, milk and peanut cream, and the same line can produce both plain wafer sheets and filled finished bars.
Advantages
- Even plate heating gives a consistent wafer thickness and pattern with low breakage.
- Multi-layer cream spreading with accurate thickness control for a uniform wafer to cream ratio.
- Easy plate replacement allows quick switching between embossed patterns and sizes.
- Energy efficient oven with insulated structure lowers running cost.
- Chocolate and packing expansion can be connected without changing the baking section.
- Stable continuous running with automatic plate lubrication and temperature feedback.

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