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Design Features of Wafer Biscuit Processing Equipment

16-07-2020

Design Features of Wafer Biscuit Processing Equipment

Design Features of Wafer Biscuit Processing Equipment

HG Admin 16-07-2020

Oven adopts double cavity structure. The heating effect of the internal furnace is better. The distributor of the wafer processing equipment and the mechanical part of the external cavity are longer. The Mitsubishi or Siemens color touch screen is used in the control part. Can display and set the operating speed of the baking pan, the temperature of the baking pan, the control of mechanical parts, the slurry volume and the ignition.
All parts of the gas system are made of excellent products at home and abroad, with complete processing equipment. The bearings of the whole machine are German SKF high-temperature bearings. The motor and reducer of the whole machine are German SEW. Long service life, use thermal energy as effectively as possible, make the wafer color uniform, and set up biscuit waste cleaning device.
Waffle biscuit production equipment has three types of 400, 600, 1000, the main working width is 400, 600, 1000mm. The production capacity is 2 tons, 4 tons and 7 tons. Far infrared electric heating, superconducting liquid heating, gas baking, automatic furnace temperature control, belt drive, stepless speed regulation, water production.
The main single machines are: pulverizer, laminator, roll cutting machine or roller printing machine, sugar and salt diffusion machine, tunnel oven, 1800 turning machine, injection molding machine, cooling conveyor, cake machine, etc. Can produce a variety of products, such as brittleness, toughness, ultra-thin, soda, sandwiches and other high, medium and low-grade products.

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  • Full automatic Baked Potato Chips Production Line
  • Full automatic Baked Potato Chips Production Line
  • Full automatic Baked Potato Chips Production Line
  • Full automatic Baked Potato Chips Production Line
  • Full automatic Baked Potato Chips Production Line